CPU over Heating

As a result, the by-products of this change magnitude sophistication include higher packing closeness associated with the true(a) mainframe calculating machine chip (or chip set) and higher speed of outgrowth and overall performance.

As if normal technological progression were non enough, many of the more sophisticated PC users (again, most specially those involved in or associated with the gaming software component of the marketplace) push the technology envelope. This class of users needs to "over quantify" the CPU, pushing the device or some other associated component, beyond the performance limits recommended by the manufacturer.

Like most "improvements" in technology, on that point is a down side. As the CPUs have increased in sophistication there has been an associated increase in the heat density of the CPU. As such, more efficient methods of cooling need to be applied to not only the CPU, but to the "motherboard" in which the CPU is typically seated.

Consequently, there needs to be a greater level of attention given to the manner and efficiency with which the CPU, and mayhap the motherboard as well as other critical computer components, are kept cool and properly functional. Specifically in the case of the CPU, a heat sink or combination of a winnow and heat sink become a highly essential element to maintaining reliable, robus

Giest, J. (2002). SECC2 Heatsink comparison. Available on-line at http://www.hardwarecentral.com (14 October 2002).

t, and proper administration operation (Kodaira, 1998).

Figure 1. Typical heat sink fan (Kodaira, 1998).

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